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PCB Fusion
US$0.01-10.00 / Piece
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What is Pump Controller Gold Finger Enig Board PCB Fusion Factory Fabrication Assembly Layout Design Services PCBA

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.01-10.00 / Piece

Sepcifications

  • Metal Coating Enig / HASL / OSP / Silver etc.
  • Mode of Production SMT / DIP / Customized
  • Layers From 2 Layers to 50 Layers
  • Base Material Fr4/ High Tg Fr4/ Metal Core / Cem
  • Certification RoHS, CCC, ISO
  • Customized Customized
  • Condition New
  • Transport Package UPS/DHL/TNT/EMS/FedEx
  • Origin China
  • Quality Standard Ipc Class 2 / Class 3
  • Flame Retardant Properties 94V0
  • Layers Count 6 Layser
  • Mininum Trace Width 2.5 Mil
  • Max Copper Thickness 10 Oz

Product Description

PCB &PCBA Cpabilities PCB Manufacturing Capabilities Layer count 1-50 layers Material FR4,Tg=135,150,170,180,210,AL base,Rogers,Nelco Copper thickness 1/2oz,1oz,2oz,3oz,4oz,5oz-10 oz Board thickness 0.2-10.0mm Min.line width/space 3/3 mil(75/75um) Min. drill size 8 mil(0.2mm) Min. HDI ...

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PCB Fusion Comparison
Transaction Info
Price US$0.01-10.00 / Piece US$0.30-1.00 / Piece US$0.30-1.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 10 Pieces 10 Pieces
Payment Terms T/T, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification RoHS, CCC, ISO RoHS, ISO, ISO13485 & IATF16949 & ISO9001 RoHS, ISO, ISO13485 & IATF16949 & ISO9001 RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America North America
Annual Export Revenue - - - - -
Business Model - - - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Quality Standard: Ipc Class 2 / Class 3;
Flame Retardant Properties: 94V0;
Layers Count: 6 Layser;
Mininum Trace Width: 2.5 Mil;
Max Copper Thickness: 10 Oz;
Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
Metal Coating: Copper / Tin / Gold / Sliver;
Mode of Production: SMT&DIP;
Layers: Singer-Layer/Double-Layer/Multilayer(Max 64layers);
Base Material: FR-4;
Customized: Customized;
Condition: Used;
BGA Minimum Dia: 01015;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCB Layer: Max 64 Layers;
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
Function Testing: Spi , Aoi , Ict, Fct , X-ray ,RoHS and Aging;
IP Protection: Strong Believe in IP Protection with Proven Record;
Turkey Service: Turkey Sourcing ,Procurement and Material Manageme;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
Supplier Name

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

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