| Specification |
Application: Aerospace, Architectural, Ceramic Decorations, Electronics, Home Use, Medical, Refractory;
Grain Size: <100nm;
Purity: 95%;
Type: Ceramic Part;
OEM: Available;
ODM: Available;
Industrial Application: Steel, Thermal Power, Cement, Coal, Ports, Petroch;
Product Type: Customized;
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Application: Aerospace, Architectural, Ceramic Decorations, Electronics, Medical, Refractory;
Grain Size: <100nm;
Purity: 99.5%;
Type: Ceramic Plate;
Density: 3.85 G/Cm³;
Max Operating Temperature ℃: 1600;
Color: White;
Hardness: 7~9.5;
Sintering Temperature ℃: 1700;
Sintering Temperature Hv: 1700;
Flexural Strength 4PT: 9.2~10.5;
Coefficient of Thermal Expansion 10-6/℃: 8;
Fracture Toughness: 200;
Thermal Conductivity W/M.K: 31;
Thermal Conductivity: >3500;
|
Application: Aerospace, Architectural, Ceramic Decorations, Electronics, Medical, Refractory;
Grain Size: <100nm;
Purity: 99.5%;
Type: Ceramic Plate;
Density: 3.85 G/Cm³;
Max Operating Temperature ℃: 1600;
Color: White;
Hardness: 7~9.5;
Sintering Temperature ℃: 1700;
Sintering Temperature Hv: 1700;
Flexural Strength 4PT: 9.2~10.5;
Coefficient of Thermal Expansion 10-6/℃: 8;
Fracture Toughness: 200;
Thermal Conductivity W/M.K: 31;
Thermal Conductivity: >3500;
|
Application: Aerospace, Architectural, Ceramic Decorations, Electronics, Medical, Refractory;
Grain Size: <100nm;
Purity: 99.5%;
Type: Ceramic Plate;
Density: 3.85 G/Cm³;
Max Operating Temperature ℃: 1600;
Color: White;
Hardness: 7~9.5;
Sintering Temperature ℃: 1700;
Sintering Temperature Hv: 1700;
Flexural Strength 4PT: 9.2~10.5;
Coefficient of Thermal Expansion 10-6/℃: 8;
Fracture Toughness: 200;
Thermal Conductivity W/M.K: 31;
Thermal Conductivity: >3500;
|
Application: Aerospace, Architectural, Ceramic Decorations, Electronics, Medical, Refractory;
Grain Size: <100nm;
Purity: 99.5%;
Type: Ceramic Plate;
Density: 3.85 G/Cm³;
Max Operating Temperature ℃: 1600;
Color: White;
Hardness: 7~9.5;
Sintering Temperature ℃: 1700;
Sintering Temperature Hv: 1700;
Flexural Strength 4PT: 9.2~10.5;
Coefficient of Thermal Expansion 10-6/℃: 8;
Fracture Toughness: 200;
Thermal Conductivity W/M.K: 31;
Thermal Conductivity: >3500;
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