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PCB
US$0.27-0.46 / PCS
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What is High Frequency PCB Multilayer Printed Circuit Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$0.46

100+ PCS US$0.27

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxy Paper Laminate
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Uc
  • Transport Package Vacuum Packing
  • Specification IPC-Class 2
  • Trademark Ucreate PCB
  • Origin Shenzhen China
  • Board Thickness 1.2~2.0mm
  • Surface Finihsing Immersional Gold
  • Lead Time 6-8 Working Days
  • Color Black

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, ...

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PCB Comparison
Transaction Info
Price US$0.27-0.46 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.01-100.00 / Piece
Min Order 1 PCS 1 PCS 1 PCS 1 PCS 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Uc;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
Color: Black;
Structure: Double-Sided Rigid PCB;
Dielectric: Tc600;
Material: Ceramic Filled PTFE/Woven Fiberglass;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Silver;
Laminate Thickness: 50mil;
Layer Count: Double Sided PCB;
Solder Mask: Black;
Structure: Double-Sided Rigid PCB;
Dielectric: Ad250;
Material: PTFE/Woven Glass;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Tin;
Laminate Thickness: 1.6mm;
Layer Count: 2-Layer;
Solder Mask: Green (Top), None (Bottom);
Structure: Double-Sided Rigid PCB;
Dielectric: RO3010;
Material: Ceramic-Filled PTFE Composite;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: HASL;
Laminate Thickness: 0.7mm (Finished);
Layer Count: 2-Layer;
Copper Weight: 1 Oz (35 μm) on Outer Layers;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4, Cu Base, High Tg Fr4, PTFE, Rogers;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Minimum Line: 0.075mm;
Minimum Space: 0.075mm;
Drilling Hole(Mechanical): 0.15mm--6.35mm;
Finish Hole(Mechanical): 0.10mm-6.30mm;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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