| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Ucreatepcb;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green/Yellow/Black/White/Red/Blue;
Number of Layers: Multilayer;
Copper Thickness: 0.5-7.0oz;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-8 Layers;
Raw Material: Aluminum Base, Copper Base;
Min Hole Size: 12mil(0.3mm);
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: HASL-Lf, Immersion Gold(Enig), Immersion Sliver,;
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Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Flex Board: 1-8 Layer;
Flex-Rigid Board: 2-10layer;
Materials: Pi, Pte, Pen, Fr-4;
Solder Mask: Yellow;
Min Slot: 24mil X 35mil;
Copper Thickness: 1/3oz - 2oz;
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Structure: 1-8 Layers FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-8 Layers;
Raw Material: Aluminum Base, Copper Base;
Min Hole Size: 12mil(0.3mm);
Min Line Width/Space: 3mil(0.075mm);
Impedance Control Tolerance: +/-10%;
Surface Finishing: HASL-Lf, Immersion Gold(Enig), Immersion Sliver,;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pi+Pi/Fr4 for Stiffener;
Insulation Materials: Organic Resin;
Brand: Exceeding;
Service: 7*24 Hours Online;
Technology: Lead The Industry;
Delivery: 5days;
Keyword: FPC;
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