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HDI PCB
US$1.20-2.00 / Piece
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What is 6 Layer HDI PCB for Medical Device Ipc-3

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$2.00

100+ Pieces US$1.20

Sepcifications

  • Structure Multilayer Rigid PCB
  • Dielectric FR-4
  • Material Epoxide Woven Glass Fabric Laminate
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Production Process Subtractive Process
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Uc
  • Transport Package Vacuum Package
  • Specification UL, RoHS, SGS, ISO9001
  • Trademark UC
  • Origin China
  • Layer 6
  • Thickness 2+/-0.18mm
  • Surface Enig
  • Trace 0.25mm/0.18mm
  • QA Ipc-3

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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HDI PCB Comparison
Transaction Info
Price US$1.20-2.00 / Piece US$0.90-2.20 / Piece US$0.90-2.20 / Piece US$0.56-5.39 / Piece US$1.00-20.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer: 6;
Thickness: 2+/-0.18mm;
Surface: Enig;
Trace: 0.25mm/0.18mm;
QA: Ipc-3;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 PCB;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Blue;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Prototype Multi-Layer PCB HDI PCB Circuit Board;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4 PCB;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: FL;
Board Material: Fr-4 (Tg 135 );
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Blue;
Silk Screen: White;
Flying Probe Test: Yes;
Product Name: Prototype Multi-Layer PCB HDI PCB Circuit Board;
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Material: Polyimide;
Copper Thickness: 1oz;
Board Thickness: 0.8mm;
Min. Hole Size: 0.2mm;
Min. Line Width: 01mm;
Min. Line Spacing: 0.09mm;
Surface Finishing: Enig;
Is_Customized: Yes;
Supply: Fast;
Service: One-Stop;
Testing: 100%;
MOQ: 1PCS;
Soldermask: White, Black, Blue, Red Ect;
Silkcreen: White, Black, Blue, Red Ect;
File: PCB File;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

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