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Assembly PCB
US$0.50-0.85 / Piece
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What is Electronic Assembly PCB PCBA Multilayer Printed Circuit Prototype Board PCB Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$0.85

100-999 Pieces US$0.80

1,000+ Pieces US$0.50

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Complex
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Ucreate PCB
  • Transport Package Vacuum Packing
  • Specification UL, RoHS, SGS, ISO9001
  • Trademark UC
  • Origin Shenzhen, China
  • Cooper Thickness 1oz
  • Silkscreen White
  • Solder Mask Type Enig
  • Board Thickness 1.6mm
  • Base Material Type Fr4

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic ...

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Assembly PCB Comparison
Transaction Info
Price US$0.50-0.85 / Piece US$110.00-130.00 / Square Meter US$120.00-150.00 / Square Meter US$0.98-5.00 / Piece US$0.65-5.00 / Piece
Min Order 10 Pieces 2 Square Meters 2 Square Meters 10 Pieces 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union LC, T/T LC, T/T T/T T/T
Quality Control
Product Certification - - UL, ISO9001, ISO/Ts16949: 2002, Is014001 and RoHS RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - - - ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Ucreate PCB;
Cooper Thickness: 1oz;
Silkscreen: White;
Solder Mask Type: Enig;
Board Thickness: 1.6mm;
Base Material Type: Fr4;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Base Material: Fr-4;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Core Base Board: 0.3mm 0.5mm 0.6mm 0.8mm 1.0mm;
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Flame Retardant Properties: V0;
The Capacity of Production: 50, 000sqm. /Month;
PP Thickness: 7628(0.18mm) 2116(0.12mm) 1080(0.08mm);
Shipment: Air,Sea,Express(DHL TNT FedEx EMS UPS);
Sample Date: 5-7days;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Zhejiang Dejia Electronics Technology Co.,Ltd.

Gold Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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