| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Enig;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Board Layer: 10L;
Surface Finihsing: Immersion Gold;
Lead Time: 6-8 Working Days;
Color: Green;
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Structure: Multilayer Rigid PCB;
Dielectric: Tc600;
Material: Ceramic Filled PTFE/Woven Fiberglass;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Bare Copper, HASL, Enig, Immersion Silver, etc.;
Laminate Thickness: 15mil 20mil 30mil 50mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Epoxy Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Copper ,PP;
Insulation Materials: Epoxy Resin;
Brand: Kb,Shenyi,Rogers,Iteq;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Minimum Line/Space: 0.075mm;
Impedance Control Tolerance: +/-10%;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Structure: Flush Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Semi-Additive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
Minimum Line/Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Structure: Multilayer Rigid PCB;
Dielectric: RO4003c;
Material: RO4003c with High Tg Fr-4;
Application: Communication;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Enig;
Board Thickness: 1.10mm (Finished);
Layer Count: 6-Layer;
Copper Weight: 1 Oz (35μm) All Layers;
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