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ESD Shielding Bag
US$0.10-0.40 / Piece
  • Recommend for you
  • What is ESD Moisture Shielding Foil Packaging Bag for Semiconductor Used

What is Eco-Friendly Moisture Barrier Laminated Bag for Electrostatic Devices

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2,000 Pieces US$0.10-0.40 / Piece

Sepcifications

  • Type Flat, Cubic, Gusset, Ziplock
  • Transport Package Carton
  • Specification 22X25CM
  • Trademark TOPCOD/OEM
  • Origin Foshan China
  • 4 Layers Pet/Al/Ny/PE
  • Thickness 0.085-0.14 mm
  • Peel Strength >3.0n/ 15mm
  • Puncture Resistance >100n
  • Applications Electronics Components, Optical Lens
  • Printing Blank or Customized
  • Application Chemical, Household, Promotion
  • Feature Antistatic, Shock Resistance, Bio-Degradable, Recyclable, Moisture Proof
  • Material Laminated Material
  • Shape Seal Bag
  • Making Process Composite Packaging Bag
  • Raw Materials High Pressure Polyethylene Plastic Bag
  • Bag Variety Upright Bag

Product Description

0.14mm Custom Anti-Static Bag Moisture Proof Foil Bag Used in SemiconductorRecommend moisture-proof packaging solutions for you~ Moisture-proof vacuum bag, also known as Aluminum foil bag, Aluminum-plastic composite vacuum bag, vacuum bag, moisture-proof bag, using imported high quality raw ...

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ESD Shielding Bag Comparison
Transaction Info
Price US$0.10-0.40 / Piece US$0.50-0.60 / Square Meter US$0.50-0.60 / Square Meter US$0.50-0.60 / Square Meter US$0.50-0.60 / Square Meter
Min Order 2,000 Pieces 2,000 Square Meters 2,000 Square Meters 2,000 Square Meters 2,000 Square Meters
Payment Terms LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, South Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, South Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, South Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, South Asia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic, South Asia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Flat, Cubic, Gusset, Ziplock;
4 Layers: Pet/Al/Ny/PE;
Thickness: 0.085-0.14 mm;
Peel Strength: >3.0n/ 15mm;
Puncture Resistance: >100n;
Applications: Electronics Components, Optical Lens;
Printing: Blank or Customized;
Application: Chemical, Household, Promotion;
Feature: Antistatic, Shock Resistance, Bio-Degradable, Recyclable, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
Application: Electronic;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
Application: Electronic;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
Application: Electronic;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Material Structure: Antistatic Plastic Film with Black Conductive Ink;
Thickness: 0.08-0.16mm;
Purpose: Electronics, Conductor, PCB, Chip, etc;
OEM: Available;
Performance: Anti-Static, Moisture Barrier;
Application: Electronic;
Feature: Antistatic, Moisture Proof;
Material: Laminated Material;
Shape: Seal Bag;
Making Process: Composite Packaging Bag;
Raw Materials: High Pressure Polyethylene Plastic Bag;
Bag Variety: Upright Bag;
Supplier Name

Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Audited Supplier

Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Audited Supplier

Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Audited Supplier

Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Audited Supplier

Foshan Shunde Topcod Industry Co., Ltd.

Diamond Member Audited Supplier

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