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Wafer Dicing Saw
US$48,000.00-50,000.00 / Piece
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What is Disco Dad3431 Semi-Automatic Wafer Dicing Saw 8 Inch High Precision Cutter R&D IC Packaging Semiconductor Cutting Machine

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$48,000.00-50,000.00 / Piece

Sepcifications

  • After-sales Service Yes
  • Species Die Cutting and Creasing Machine
  • Imprinting Type Platen
  • Placing Form of Template Vertical
  • Die Cutting Tool Steel Plate
  • Computerized Computerized
  • Automatic Grade Automatic
  • Application Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials
  • Transport Package Wooden Case
  • Trademark DISCO
  • Origin USA
  • Machine Type Semi-Automatic Dicing Saw
  • Max. Workpiece Size 200mm (8-Inch) / Square up to 200X200mm
  • Spindle Power 1.8 Kw (Standard, High Torque Option Available)
  • Spindle Speed 3, 000 ~ 60, 000 Rpm
  • X-Axis Feed Speed 0.1 ~ 600 mm/S
  • Cutting Accuracy < 0.003 mm / 260 mm
  • Applications IC, Mems, LED, Sic, GaN, Glass, Ceramic

Product Description

DISCO DAD3431: The Perfect Balance of Precision and Expandability Engineer your path to success with the DISCO DAD3431 Precision Dicing Saw. Designed as the successor to the popular 341 series, this machine is the ideal choice for Research &Development (R&D) laboratories, pilot production lines, ...

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Wafer Dicing Saw Comparison
Transaction Info
Price US$48,000.00-50,000.00 / Piece US$10,000.00-100,000.00 / Piece US$48,000.00-50,000.00 / Piece US$22,000.00-42,000.00 / Piece US$48,000.00-50,000.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
After-sales Service: Yes;
Species: Die Cutting and Creasing Machine;
Imprinting Type: Platen;
Placing Form of Template: Vertical;
Die Cutting Tool: Steel Plate;
Computerized: Computerized;
Automatic Grade: Automatic;
Application: Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials;
Machine Type: Semi-Automatic Dicing Saw;
Max. Workpiece Size: 200mm (8-Inch) / Square up to 200X200mm;
Spindle Power: 1.8 Kw (Standard, High Torque Option Available);
Spindle Speed: 3, 000 ~ 60, 000 Rpm;
X-Axis Feed Speed: 0.1 ~ 600 mm/S;
Cutting Accuracy: < 0.003 mm / 260 mm;
Applications: IC, Mems, LED, Sic, GaN, Glass, Ceramic;
After-sales Service: Yes;
Species: Die Cutting and Creasing Machine;
Imprinting Type: Platen;
Computerized: Computerized;
Automatic Grade: Automatic;
Application: Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials;
Maximum Workpiece Size: φ200mm (8 Inches);
Compatible Sizes: φ150mm (6 Inches) and Smaller;
X-Axis Cutting Speed: 0.1 ~ 1.000 mm/S;
X-Axis Travel Range: 210 mm;
Y1-Y2 Axis Positioning Accuracy: Within 0.002 mm / 210 mm;
Moving Resolution: 0.0002 mm;
Chuck Table Size: 200mm;
After-sales Service: Yes;
Species: Die Cutting and Creasing Machine;
Imprinting Type: Platen;
Placing Form of Template: Vertical;
Die Cutting Tool: Steel Plate;
Computerized: Computerized;
Automatic Grade: Automatic;
Application: Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials;
Machine Type: Semi-Automatic Dicing Saw;
Max. Workpiece Size: 200mm (8-Inch) / Square up to 200X200mm;
Spindle Power: 1.8 Kw (Standard, High Torque Option Available);
Spindle Speed: 3, 000 ~ 60, 000 Rpm;
X-Axis Feed Speed: 0.1 ~ 600 mm/S;
Cutting Accuracy: < 0.003 mm / 260 mm;
Applications: IC, Mems, LED, Sic, GaN, Glass, Ceramic;
After-sales Service: Yes;
Species: Die Cutting and Creasing Machine;
Imprinting Type: Platen;
Computerized: Computerized;
Automatic Grade: Automatic;
Application: Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials;
Maximum Workpiece Size: 8 Inches (200mm);
Chuck Table Size: 200mm;
Chuck Table Rotation: 320°;
Cutting Speed: 0.1 ~ 1,000 mm/S;
X-Axis Cutting Range: 260mm;
After-sales Service: Yes;
Species: Die Cutting and Creasing Machine;
Imprinting Type: Platen;
Placing Form of Template: Vertical;
Die Cutting Tool: Steel Plate;
Computerized: Computerized;
Automatic Grade: Automatic;
Application: Paper Packaging Materials, Stickers Products, Heat Insulation Material, Insulating Materials;
Machine Type: Semi-Automatic Dicing Saw;
Max. Workpiece Size: 200mm (8-Inch) / Square up to 200X200mm;
Spindle Power: 1.8 Kw (Standard, High Torque Option Available);
Spindle Speed: 6, 000 ~ 60, 000 Rpm (Variable Frequency Control);
Materials Processed: Silicon, Sic, Sapphire, Glass, Quartz, Ceramic, PC;
Supplier Name

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

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