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SMD Pick and Place Machine
US$18,000.00-28,000.00 / Piece
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What is SMT Pick and Place Machine Tc06 Desktop LED PCB Assembly Machine for Small & Medium Studios

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$18,000.00-28,000.00 / Piece

Sepcifications

  • After-sales Service Yes
  • Condition New
  • Speed High Speed
  • Precision High Precision
  • Certification CCC, PSE, FDA, RoHS, ISO
  • Warranty 6 Months
  • Automatic Grade Automatic
  • Type High-speed Chip Mounter
  • Transport Package Wooden Case
  • Trademark CH
  • Origin China
  • Delivery Time About 15 Days
  • Power Supply AC 220V (50Hz, Single-Phase), 3 Kw
  • Air Supply 0.5MPa ~0.7MPa
  • Vacuum Generation Built-in Vacuum Pump
  • Mounting Head Quantity 6
  • Component Height ≤12mm
  • PCB Thickness 0.6mm~3.5mm

Product Description

The TC06 is a high-precision, high-speed 6-head SMT placement machine. With a slim profile of only 90cm in width, it effortlessly fits into elevators, ensuring easy transportation and flexible deployment in factories or studios. Its space-saving design allows for seamless multi-unit integration, ...

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SMD Pick and Place Machine Comparison
Transaction Info
Price US$18,000.00-28,000.00 / Piece US$32,500.00-58,000.00 / Piece US$32,500.00-58,000.00 / Piece US$22,500.00-48,000.00 / Piece US$32,500.00-58,000.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification CCC, PSE, FDA, RoHS, ISO CCC, PSE, FDA, RoHS CCC, PSE, FDA, RoHS CCC, PSE, FDA, RoHS CCC, PSE, FDA, RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
After-sales Service: Yes;
Condition: New;
Speed: High Speed;
Precision: High Precision;
Warranty: 6 Months;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Delivery Time: About 15 Days;
Power Supply: AC 220V (50Hz, Single-Phase), 3 Kw;
Air Supply: 0.5MPa ~0.7MPa;
Vacuum Generation: Built-in Vacuum Pump;
Mounting Head Quantity: 6;
Component Height: ≤12mm;
PCB Thickness: 0.6mm~3.5mm;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Type: Full-Automatic High-Speed Die Bonder;
Die Bonding Mode: Sheet-to-Sheet Transfer Table in-Line Connection;;
in-Line Compatibility: Compatible with Screen Printers for Multiple in-Li;
Power Supply: AC 380V, 50/60 Hz, 4.2 Kw;
Air Supply: 0.5 - 0.7 MPa Dry Compressed Air;
Operating Temperature: 10 - 40 °C;
Operating Humidity: 30% - 60% Rh (No Condensation);
Maximum Die Bonding Speed: 6500 PCS/H;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Type: Full-Automatic High-Speed Die Bonder;
Die Bonding Mode: Sheet-to-Sheet Transfer Table in-Line Connection;;
in-Line Compatibility: Compatible with Screen Printers for Multiple in-Li;
Power Supply: AC 380V, 50/60 Hz, 4.2 Kw;
Air Supply: 0.5 - 0.7 MPa Dry Compressed Air;
Operating Temperature: 10 - 40 °C;
Operating Humidity: 30% - 60% Rh (No Condensation);
Maximum Die Bonding Speed: 6500 PCS/H;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Type: Precision Die Bonding Equipment;
Die Bonding Mode: Two-Stage Relay Die Bonding; Single Swing Arm 180°;
Film Expanding Function: 10-Inch Auto Film Expanding (Optional: 10-Inch/8-I;
Power Supply: AC 380V, 50/60 Hz, 4.5 Kw;
Air Supply: 0.5 - 0.7 MPa Dry Compressed Air;
Operating Temperature: 10 - 40 °C;
Operating Humidity: 30% - 60% Rh (No Condensation);
Maximum Die Bonding Speed: 3800 PCS/H;
Speed: High Speed;
Precision: High Precision;
Automatic Grade: Automatic;
Type: High-speed Chip Mounter;
Equipment Type: Full-Automatic High-Speed Die Bonder;
Die Bonding Mode: Sheet-to-Sheet Transfer Table in-Line Connection;;
in-Line Compatibility: Compatible with Screen Printers for Multiple in-Li;
Power Supply: AC 380V, 50/60 Hz, 4.2 Kw;
Air Supply: 0.5 - 0.7 MPa Dry Compressed Air;
Operating Temperature: 10 - 40 °C;
Operating Humidity: 30% - 60% Rh (No Condensation);
Maximum Die Bonding Speed: 6500 PCS/H;
Supplier Name

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Tengxiangjia Technology Co., Ltd.

Diamond Member Audited Supplier

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