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Price
Min. Order Reference FOB Price
1 Piece US$280,000.00-320,000.00 / Piece
Sepcifications
- After-sales Service Response Within 4 Hours, Reach The Scene Within 48
- Warranty Shelf Life 1 Year
- Type Surface Grinding Machine
- Processing Object Curve
- Abrasives Grinding Wheel
- Controlling Mode Artificial
- Automatic Grade Semiautomatic
- Cylindrical Grinder Type Universal Cylindrical Grinder
- Precision High Precision
- Certification ISO 9001
- Condition New
- Transport Package Wood Crate
- Specification 1200× 16150× 2400 mm
- Trademark PONDA
- Origin China
- Wheel Diameter Medium 209 mm
- Wheel R. Speed 500- 3000 Min-1
- G. Wheel R.Speed 0-4000min
- Vacuum Table R.Speed 0-300min
- in-Feed Resolution 0.1-80um/S
- Fast Traverse Speed 10mm/S
- Max.Vacuum Pressure -90 Kpa
- Ttv Less Than or Equal To3um
- Surface Roughness Ra0.015um
- Total Power 3.7kw
- External Dimension 1750×1250×1550
- Total Weight 1700kg
- No.of Vacuum Table 3
- Applicable Wafer Size 2 To12-Inch Standard Wafer
Product Description
Product Description The FDC wafer edge grinder is mainly used for edge chamfering of wafers. During the manufacturing process of chips, there may be issues with unevenness and sharpness at the edges, which may affect subsequent processing and use. Using a wafer edge rounding machine can round the ...
