How to Use a Capable of Edging Two Wafers Simultaneously Fully Automatic Edging Machine
Price
Min. Order Reference FOB Price
1 Piece US$280,000.00-320,000.00 / Piece
Sepcifications
- After-sales Service 12months
- Warranty 12months
- Automatic Automatic
- Style Flat Workpieces
- Certification CE, ISO
- Transport Package Wood Crate
- Specification 2000× 1150× 1950mm
- Trademark PONDA
- Origin China
- Power Source Electricity
- Working Style High-Speed Universal
- Variable Speed with Variable Speed
- Object Wafer
- Application Electronic Technique
- Disc(Wheel) Type Chamfering Machine
- Material Metal and Non-Metal
- Disc Diameter 2/4/6-Inch 4/6/8-Inch
- Weight 1000kg
- Applicable Wafer Size 2/4/6-Inch 4/6/8-Inch
- Wheel Diameter Medium 205 mm
- Wheel R. Speed 500- 3000 Min-1
- Wheel Motor Power 1kw
- Max. Travserse Rate 10 mm/S
- in-Feed Resolution 0.5μm/S
Product Description
Product Description The FDC wafer edge grinder is mainly used for edge chamfering of wafers. During the manufacturing process of chips, there may be issues with unevenness and sharpness at the edges, which may affect subsequent processing and use. Using a wafer edge rounding machine can round the ...
