| Specification |
Structure: Multilayer FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Electronic Equipment;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Snt;
Type: Flexible;
Usage: Playback Switch, Disconnector, Change-Over Switch, Control Switch;
Application: Home Appliance, Telecommunication Equipment, with Remote Control, Calculator, Electronic Equipment;
Number of Switch: Multi Control Switch;
Structure: FPC;
Material: Pet/PVC/Rubber/Glass/Acrylic/Polycarbonate/Metal;
Contact Type: FPC Terminal Connector;
Detection Method: Circuit Function Testing Equipment;
Brand: Snt;
Function: Durable, Waterproof, Dustproof, UV Resistant;
Logo/Design: Customized;
Dimension/Shape: OEM Service;
Color: Pantone, Ral, Cmyk;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Pi, Copper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
|
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Picopper and Ni/Au;
Insulation Materials: Organic Resin;
Brand: Smart;
Supplier Type: Manufacturer;
Copper Thickness: 0.5oz;
Min. Hole Size: 0.15mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.075mm;
Stiffener: Without, Top, Bot, Both Sides;
Solder Mask(Coverlay): Yellow, White, Black;
Surface Finishing: Enig, Immersion Silver, OSP;
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