| Specification |
Structure: Single-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Door Lock;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Etching;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Snt;
Size: Customizable;
Thickness: 0.08-0.32mm;
Tensile Strength: ≥200 MPa;
Working Temp.: -269℃~+250℃;
Feature 1: Chemical Resistance;
Feature 2: Oil-Resistant;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Smart Home Appliance FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Appliance Switch FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Des;
Base Material: Polyimide;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Back Adhesive: High Temperature Resistant, Strong Adhesion;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Without Adhesive Flexible Plate;
Application: Headphone Controller FPC;
Conductive Adhesive: N/a;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Polyimide;
Brand: Bohaiming;
Insulation Layer Thickness: 25μm;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm;
Coverlay Color: Black, White, Yellow;
Min. Through Hole Size: 0.03mm / 0.03mm (1.2mil);
Stiffener Material: Pi, Fr4, Stainless Steel (SUS301);
Surface Finish: Enig (Immersion Gold) / Soft Gold;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Mobile Phone, Automotive Tail Light FPC;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Bohaiming;
Outer Layer Copper Thickness: 1/3oz;
Minimum Line Width/Spacing: 0.03mm / 0.03mm 1.2mil / 1.2mil;
Coverlay Color: Amber (Yellow), Black, White, Customized;
Back Adhesive: 3m 467MP / 9448A High Temp. Resistant & High Bond;
Stiffener Material: Pi / Fr4 / Stainless Steel (SUS);
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