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DIY PCB
US$0.30-5.00 / pieces
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What is Smart Electronics Mini Solderless Prototype Breadboard Kit DIY Set PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$5.00

100-999 pieces US$1.00

1,000+ pieces US$0.30

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong China
  • Selling Units Single Item
  • Silkscreen White, Black
  • PCB Type Rigid, Flexible, Rigid-Flexible
  • Number of Layers 4-Layer
  • Copper Thickness 10z
  • Product Name Single Layer PCB or 1-24 Layers PCB
  • Min. Hole Size 0.1mm
  • Min.Line Spacing 0.075mm
  • Solder Mask Color White Black Yellow Green Red Blue Orange Purple
  • Surface Treatment HASL, Lf Haslimm Gold, Lmm Silverosp etc
  • Min.Line Width 0.15mm
  • Board Thickness 1.6mm
  • Surface Finishing Customized According to Customer Requirements

Product Description

Products Description Company Capability PCB Capacities and Technical Specification Order Quantity 1-500,000 Layer 1, 2, 4, 6, up to 24 layer Material FR-4, High Tg, Isola, Aluminum, Rogers, etc PCB type Rigid, flexible, rigid-flexible Shape Rectangular, round, slots, cutouts, complex, ...

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DIY PCB Comparison
Transaction Info
Price US$0.30-5.00 / pieces US$0.50-1.00 / Piece US$4.50-6.50 / Piece US$164.30 / Piece US$46.50 / Piece
Min Order 5 pieces 10 Pieces 10 Pieces 2 Pieces 5 Pieces
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - Others Others Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America North America, Europe North America, Europe North America, Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM ODM, OEM - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Smart;
Selling Units: Single Item;
Silkscreen: White, Black;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Number of Layers: 4-Layer;
Copper Thickness: 10z;
Product Name: Single Layer PCB or 1-24 Layers PCB;
Min. Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Solder Mask Color: White Black Yellow Green Red Blue Orange Purple;
Surface Treatment: HASL, Lf Haslimm Gold, Lmm Silverosp etc;
Min.Line Width: 0.15mm;
Board Thickness: 1.6mm;
Surface Finishing: Customized According to Customer Requirements;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Item: Core Development Board;
Model: Esp32-S3;
Chip: CH340K/CH343p;
Format: N8r2/N8r8/N16r8;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Banana Pi;
Item: Development Board;
Model: Banana Pi M7;
CPU: Rk3588;
RAM: 8GB/32GB;
Emmc: 64GB/128GB;
BLE: Bluetooth 5.2;
Network: Onboard WiFi 6;
Size: 92*62mm;
Type: Combining Rigid Circuit Board;
Dielectric: SIC;
Material: Aluminum Covered Copper Foil Layer;
Application: Medical Instruments;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Banana Pi;
Item: Development Board;
Model: Banana Pi M5;
CPU: Amlogic S905X3;
GPU: Mali-G31 MP2 GPU;
RAM: 4GB Lpddr4;
Emmc: 16GB;
Power: 5V3a Via Micro USB (Type C);
Size: 85*56mm;
Weight: 45g;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier

Sunhokey Electronics Co., Ltd.

Gold Member Audited Supplier

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