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Manufacturing PCB
US$1.00-5.00 / Piece
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What is Smart Electronics High Precision Multi-Layer PCB Remote Control Circuit Board Manufacturing PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 Pieces US$5.00

100-999 Pieces US$3.00

1,000+ Pieces US$1.00

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Cem-1,Aluminium
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification Customized
  • Trademark Smart
  • Origin Guangdong, China
  • Number of Layers 2/4/6/8/12/Custom
  • Copper Thickness 0.5-6.0oz
  • Board Size Custom
  • PCB Cutting Shear V-Score, Tab-Routed
  • Min Trace/Gap 0.075mm or 3mil
  • Board Thickness 0.2-4.0mm

Product Description

PCB Capacities and Technical Specification Order Quantity 1-500,000 Layer 1, 2, 4, 6, up to 24 layer Material FR-4, High Tg, Isola, Aluminum, Rogers, etc PCB type Rigid, flexible, rigid-flexible Shape Rectangular, round, slots, cutouts, complex, irregular Max PCB dimensions ...

Learn More

Manufacturing PCB Comparison
Transaction Info
Price US$1.00-5.00 / Piece US$0.10-80.00 / Piece US$0.01-0.05 / Piece US$0.10-20.00 / Piece US$0.10-80.00 / Piece
Min Order 5 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Product Certification - UL,ISO9001&ISO14001,SGS,RoHS Report UL, ISO9001&ISO14001, SGS, RoHS Report UL,ISO9001&ISO14001,SGS,RoHS,Ts16949 UL, ISO9001&ISO14001, SGS, RoHS Report
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-8oz;
Hard Gold Thickness: 1-50u'';
Enig Thickness: 1-3u'';
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Hole: Blind/Buried Via, Via in Pads;
Pth Wall: 20um;
Copper Thick: 3oz;
Board Thick: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kb;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Thickness: 0.15/0.8/1.0/1.6/2.0/2.4/2.8/3.0/3.2mm;
Inner Copper: 1/2/3/4 Oz;
Finish Copper: 1/2/3/4 Oz;
Surface Finish: Enig/HASL/HASL Lf/OSP;
Solder Mask: Green/White/Red/Orange/Purple;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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