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Fr4 PCB
US$0.30-5.00 / pieces
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What is Smart Electronics Immersion Gold PCB Fr4 Material PCB Fabrication with Gold Plating Surface Finish PCB

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 pieces US$5.00

100-999 pieces US$2.50

1,000+ pieces US$0.30

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Cem-1,Aluminium
  • Insulation Materials Organic Resin
  • Model PCB
  • Brand Smart
  • Transport Package Carton
  • Specification custom
  • Trademark Smart
  • Origin Guangdong, China
  • Selling Units Single Item
  • Min Drill Hole Diameter 0.010.1mm or 10mil
  • Number of Layers 2/4/6/8/12/Custom
  • Copper Thickness 0.5-6.0oz
  • Min Trace/Gap 0.075mm Or3mil
  • Silk Scre En Min Line Width 0.006or0.15mm
  • Board Size Custom
  • PCB Cutting Shear V-Score, Tab-Routed
  • Board Thickness 0.2-4.0mm

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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Fr4 PCB Comparison
Transaction Info
Price US$0.30-5.00 / pieces US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 5 pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Smart;
Selling Units: Single Item;
Min Drill Hole Diameter: 0.010.1mm or 10mil;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min Trace/Gap: 0.075mm Or3mil;
Silk Scre En Min Line Width: 0.006or0.15mm;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Board Thickness: 0.2-4.0mm;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Material: Customized;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: FR-4;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: Aluminum 5052 Core (1.2mm);
Thermal Conductivity: 2W/M·K (Dielectric Layer);
Copper Foil: 70/70μm;
Tg: 130°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Model: PCB;
Brand: Hongyu;
Board Thickness: 0.8mm;
Metal Core PCB: T2 High Conductivity Copper(0.8mm);
Thermal Conductivity: 398W/M·K (Dielectric Layer);
Copper Foil: 35/35μm;
Tg: 150°C;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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