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Multilayer HDI PCB
US$0.50-3.00 / Piece
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What is Multilayer High-Density HDI PCB Board Custom PCB Prototype & Mass Production Factory

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

5-99 Pieces US$3.00

100-999 Pieces US$1.50

1,000+ Pieces US$0.50

Sepcifications

  • Type Multilayer PCB
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Consumer Electronics
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Fr4,Tg,Cem-1,Aluminium
  • Insulation Materials Organic Resin
  • Brand Smart
  • Transport Package Carton
  • Specification Customized
  • Trademark Smart
  • Origin Guangdong, China
  • Min Drill Hole Diameter 0.010.1mmor 10 Mil
  • Number of Layers 2/4/6/8/12/14orcustom
  • Single Gross Weight Kg
  • Copper Thickness 0.5-6.0oz
  • Board Size Custom
  • PCB Cutting Shear V-Score, Tab-Routed
  • Min Trace/Gap 0.075mm or 3mil
  • Board Thickness 0.2-4.0mm

Product Description

Products Description Product Name Custom Electronic Printed Circuit Board PCB Assembly Services OEM Other Multilayer PCB PCBA Manufacture Our Service Electronic Engineering; PCB Manufacturing; Turnkey PCBA; PCB Clone; SMT; Component Sourcing; PCB Assembly; Plugin Assembly; Packing Ect. Main ...

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Multilayer HDI PCB Comparison
Transaction Info
Price US$0.50-3.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece US$35.00 / Piece
Min Order 5 Pieces 500 Pieces 500 Pieces 500 Pieces 500 Pieces
Payment Terms T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia North America, South America, Southeast Asia
Annual Export Revenue - - - - -
Business Model Own Brand, ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 1-3 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Min Drill Hole Diameter: 0.010.1mmor 10 Mil;
Number of Layers: 2/4/6/8/12/14orcustom;
Single Gross Weight: Kg;
Copper Thickness: 0.5-6.0oz;
Board Size: Custom;
PCB Cutting: Shear V-Score, Tab-Routed;
Min Trace/Gap: 0.075mm or 3mil;
Board Thickness: 0.2-4.0mm;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Complex;
Application: Communication;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Cookermore;
Supplier Name

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

Guangdong Cookermore CO., Ltd

Diamond Member Audited Supplier

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