| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr-4,Fr-1,Cem-1,Cem-3,Fr-4 Halogen Free;
Customized: Customized;
Condition: New;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Copper Thickness: 1oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
Type: Rigid, Flexible, Rigid-Flexible;
Functional Application: Smart Electronics;
Application: Consumer Electronics;
Board Thickness: 0.2mm-4mm;
Surface Finishing: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 4.5kw;
Rated Voltage: Single Phase AC220V;
Heat-Dissipating Method: Air Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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Metal Coating: Copper;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Rated Power Input: 1.5kw;
Rated Voltage: Single Phase AC220V;
Heat-Dissipating Method: Liquid Cooling;
Operating Power Frequency: 50/60 Hz;
Type of Compressor: BLDC/Pmsm;
Communicated Method: RS485;
Refrigerant: R410;R32;R290;
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