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Diode Module
US$10.00-20.00 / Piece
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What is High Reliable Mixed Power Rectifier Diode Module Thyristor Module MFC300 for UPS/Power Supply

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

3 Pieces US$10.00-20.00 / Piece

Sepcifications

  • Application Diode, Power Electronic Components, Temperature Measurement, Power Supply, AC/DC Motor Control, Soft Start, etc
  • Batch Number 2024+
  • Certification CCC, CE, RoHS
  • Manufacturing Technology Discrete Device
  • Material Power Semiconductor
  • Model MFC300
  • Package SMD
  • Signal Processing Digital
  • Type Intrinsic Semiconductor
  • Transport Package Carton Box
  • Specification 50*40*30
  • Trademark SAILTON
  • Origin China
  • Quality Guarantee
  • Customized Yes
  • Feature Easy to Install and International Standard Packing
  • Cooling Water-Cooling or Air-Cooling
  • Service High
  • Price Term Fob/CPT/EXW/CIF
  • Delivery Time 3-7 Days
  • Delivery Port Tianjin, China
  • Brand Sailton
  • Applications AC/DC Motor Control/Soft Start/Power Supply, etc.

Product Description

SAILTON Brand High Reliable Rectifier/Thyristor Mixed Power Module MFC300 (Prices are for reference only, please contact salesman for specific prices) Introduction We proudly offer an extensive array of power modules, including thyristor modules, diode modules, SCR modules, fast ...

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Diode Module Comparison
Transaction Info
Price US$10.00-20.00 / Piece US$36.00-41.00 / pc US$36.00-41.00 / pc US$36.00-41.00 / pc US$51.00-56.00 / pc
Min Order 3 Pieces 100 pc 100 pc 100 pc 100 pc
Payment Terms LC, T/T T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
Quality Control
Product Certification CCC, CE, RoHS - - - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue - - - - -
Business Model OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Application: Diode, Power Electronic Components, Temperature Measurement, Power Supply, AC/DC Motor Control, Soft Start, etc;
Batch Number: 2024+;
Manufacturing Technology: Discrete Device;
Material: Power Semiconductor;
Model: MFC300;
Package: SMD;
Signal Processing: Digital;
Type: Intrinsic Semiconductor;
Quality: Guarantee;
Customized: Yes;
Feature: Easy to Install and International Standard Packing;
Cooling: Water-Cooling or Air-Cooling;
Service: High;
Price Term: Fob/CPT/EXW/CIF;
Delivery Time: 3-7 Days;
Delivery Port: Tianjin, China;
Brand: Sailton;
Applications: AC/DC Motor Control/Soft Start/Power Supply, etc.;
Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100Ω;
Front Side: Polished;
Backside: Etched;
Diameter: 150±0.3mm;
Thickness: 675±25mm;
Oxide Thickness: 5000A;
Ttv: ≤10μm;
Warp: ≤30μm;
Bow: ≤30μm;
Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100ω;
Front Side: Polished;
Backside: Etched;
Diameter: 150±0.3mm;
Thickness: 675±25mm;
Oxide Thickness: 5000A;
Ttv: ≤10μm;
Warp: ≤30μm;
Bow: ≤30μm;
Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100ω;
Front Side: Polished;
Backside: Etched;
Diameter: 200±0.2mm;
Thickness: 725±25mm;
Oxide Thickness: 5000A;
Ttv: ≤25μm;
Warp: ≤40μm;
Bow: ≤40μm;
Application: Semi Standard;
Material: Compound Semiconductor;
Growth Method: CZ;
Crystal Orientation: 100;
Dopant: Boron;
Resistivity: 1-100ω;
Front Side: Polished;
Backside: Etched;
Diameter: 200±0.2mm;
Thickness: 725±25mm;
Oxide Thickness: 20000A;
Ttv: ≤25μM;
Warp: ≤40μM;
Bow: ≤40μM;
Supplier Name

Sailing Commercial (Tianjin) Co., Ltd.

Diamond Member Audited Supplier

Fine Silicon Manufacturing(Shanghai)Ltd.

Gold Member Audited Supplier

Fine Silicon Manufacturing(Shanghai)Ltd.

Gold Member Audited Supplier

Fine Silicon Manufacturing(Shanghai)Ltd.

Gold Member Audited Supplier

Fine Silicon Manufacturing(Shanghai)Ltd.

Gold Member Audited Supplier

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