| Specification |
Conductive Type: Unipolar Integrated Circuit;
Integration: MSI;
Mounting Type: SMT;
Operating Temperature: -20℃~40℃;
Shape: Board;
Technics: Application-Specific Integrated Circuit;
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Mounting Type: Surface Mount;
Operating Temperature: -40°c ~ 125°c (Tj);
Technics: Semiconductor IC;
Motor Type - AC, DC: Brushless DC (BLDC);
Function: Driver - Fully Integrated, Control and Power Stage;
Output Configuration: Half Bridge (3);
Interface: Parallel;
Technology: Bicdmos;
Current - Output: 2.8A;
Voltage - Supply: 7V ~ 52V;
Voltage - Load: 7V ~ 52V;
Package / Case: 20-DIP (0.300", 7.62mm);
Supplier Device Package: 20-Powerdip;
Base Product Numbe: L6234;
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Mounting Type: Surface Mount;
Operating Temperature: -40°C ~ 85°C;
Technics: Semiconductor IC;
Resolution (Bits): 12 B;
Voltage - Supply: 1.8V, 3.3V;
Package / Case: 88-Vfqfn Exposed Pad, Csp;
Supplier Device Package: 88-Lfcsp-Vq (12X12);
Base Product Number: Ad9914;
1: Surface Mount;
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Mounting Type: Surface Mount;
Operating Temperature: -40°c ~ 150°c (Tj);
Technics: Semiconductor IC;
Driven Configuration: Low-Side;
Channel Type: Independent;
Number of Drivers: 2;
Gate Type: IGBT, N-Channel Mosfet;
Voltage - Supply: 6V ~ 20V;
Logic Voltage - Vil, Vih: 0.8V, 2.7V;
Current - Peak Output (Source, Sink): 2.3A, 3.3A;
Input Type: Non-Inverting;
Rise / Fall Time (Typ): 15ns, 10ns;
Package / Case: 8-Soic;
Base Product Number: IR4427;
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Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
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