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PS OEM ODM Multilayer Flexible Printed Circuit Board FPC PCB Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$5.00

100-999 Pieces US$1.00

1,000+ Pieces US$0.10

Sepcifications

  • Structure Multilayer FPC
  • Material Polyimide
  • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
  • Conductive Adhesive Conductive Silver Paste
  • Flame Retardant Properties V0
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand PS
  • Transport Package Box
  • Specification <1500mm
  • Trademark PS Electronics
  • Origin China
  • Quality Test Aoi, 100% E-Test
  • V- Cut Tolerance +-10mi
  • Bevel Edge +-5mil
  • Hole Location Tolerance +-2mil
  • Hole Diameter Tolerance +-0.05mm
  • Board Thickness Tolerance +-5%
  • Line Width/Space Tolerance +-10%

Product Description

PCB Parameters Item PCB Parameters Material FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc Material Brands KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or ...

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PCB Design Comparison
Transaction Info
Price US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece US$0.10-5.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms - - - - -
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - - - - -
Average Lead Time Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months		 Peak Season Lead Time: 3-6 months
Off Season Lead Time: 3-6 months
Product Attributes
Specification
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Structure: Multilayer FPC;
Material: Polyimide;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: PS;
Quality Test: Aoi, 100% E-Test;
V- Cut Tolerance: +-10mi;
Bevel Edge: +-5mil;
Hole Location Tolerance: +-2mil;
Hole Diameter Tolerance: +-0.05mm;
Board Thickness Tolerance: +-5%;
Line Width/Space Tolerance: +-10%;
Supplier Name

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

Ps Electronics Co., Ltd

Diamond Member Audited Supplier

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