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Rigid-Flex PCB Assembly
US$1.00-20.00 / Piece
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What is Advanced Integrated Rigid-Flex PCBA for Aerospace and Robotics Applications ISO13485

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-20.00 / Piece

Sepcifications

  • Insulation Materials Organic Resin
  • Flame Retardant Properties HB
  • Application Aerospace
  • Transport Package ESD Bag, Carton Box
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Product Name High Complexity PCBA
  • Service PCB+Assembly+Components
  • Testing Service Electrical Testing, Flying Probe Tester, Functiona
  • Value-Added Services Bom Analysis, Conformal Coating, IC Programming
  • Technical Support Free Dfm/a Check, Bom Analysis
  • Placement Precision ±0.03mm / ±0.01mm (Chip)

Product Description

Workshop Introduction Product Description High Complexity PCB Assembly PCBA Specification Turnkey Service PCB Design + PCB FAB + Component Sourcing + PCBA + Box Building + Packaging Value-Added Services BOM Analysis, Conformal Coating, IC Programming, Wire Harness &Cable Assembly, Ageing &Testing ...

Learn More

Rigid-Flex PCB Assembly Comparison
Transaction Info
Price US$1.00-20.00 / Piece US$0.01-20.00 / Piece US$0.10-80.00 / piece US$0.01 / piece US$0.10-10.00 / piece
Min Order 1 Piece 1 Piece 1 piece 1 piece 1 piece
Payment Terms - LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Insulation Materials: Organic Resin;
Flame Retardant Properties: HB;
Application: Aerospace;
Product Name: High Complexity PCBA;
Service: PCB+Assembly+Components;
Testing Service: Electrical Testing, Flying Probe Tester, Functiona;
Value-Added Services: Bom Analysis, Conformal Coating, IC Programming;
Technical Support: Free Dfm/a Check, Bom Analysis;
Placement Precision: ±0.03mm / ±0.01mm (Chip);
Insulation Materials: Organic Resin;
Flame Retardant Properties: V0;
Application: Consumer Electronics;
Used in: Automotive, Aerospace, Digital, Computer, LED, etc;
Solder Mask: N/a;
Max Copper: 6 Oz;
Min Thickness: 0.15 mm;
Max Layer: 8 Layer;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen;
Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Application: Computer with LCD Screen;
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Abis;
Insulation Materials: Epoxy Resin;
Flame Retardant Properties: V0;
Board Thickness: 0.2mm;
Copper Thickness: 30um;
Surface Finish: Enig;
Solder Mask: Green;
Legend: White;
Supplier Name

Primustron Electronics

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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