| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Mx-P-20;
Product Name: Fingerprint Integrated Module;
Storage Capacity: 10 Pieces;
Working Voltage: 3.0-4.2V;
Working Temperature: -20% -+70%;
Fingerprint Collection Area: 10.5 * 11.5mm;
Acquisition Resolution: 160 * 160 (Dpi);
Current: 20 (Ma);
LED Lights: Red/Blue/Green;
Battery: 3.7V Lithium Battery;
Charging Port+Emergency Interface: USB Micro;
Low Battery Alarm: Supported;
APP Control: Not Supported (Customizable);
System: Independent Operation;
Other Structural Accessories: Customized;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
|
Metal Coating: Tin;
Mode of Production: DIP;
Layers: Double-Layer;
Customized: Customized;
Condition: New;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Copper Thickness: 1oz;
Finished Thickness: 0.2-4mm;
Minimum Solder Resist Bridge: 0.1mm;
Minimum Linewidth: 0.075mm;
Supplier Type: PCBA;
Type: Smart Electronics PCBA;
Mounting Component Pitch: 0.15mm;
Minimum Hole Diameter: 0.15mm;
Accuracy of Printing Solder Paste: 0.025mm;
Minimum Linespacing: 0.075mm;
Repeated Accuracy: 0.01mm;
|
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: Fr-4fr-1,Cem-1,Cem-3fr-4 Halogen Free;
Customized: Customized;
Condition: New;
Layer: 1-24 Layers;
Material: Fr-4, High Tg, Isola, Aluminum, Rogers, etc;
PCB Type: Rigid, Flexible, Rigid-Flexible;
Surface Finish: HASL, Lf HASL, Imm Gold, Imm Silver, OSP etc;
Solder Mask: Green, Red, White, Yellow, Blue, Black, Orange etc;
Min Linewidth/Linespacing: 0.075mm;
Min Hole Diameter: 0.15mm;
Min Solder Resist Bridge: 0.1mm;
Finished Thickness: 0.2-4mm;
Mounting Component Pitch: 0.15mm;
|