| Specification |
Metal Coating: According to Customer Needs;
Mode of Production: SMT, DIP, Tht;
Layers: Single-Layer, Double-Layer, Multilayer;
Base Material: According to Customer Needs;
Customized: Customized;
Condition: New;
Layer Counts: 2-50 Layers;
Components Size: SMT 01005 to 100mmx80mm;
Minimum Width/Space of Qfp: 0.15mm/0.3mm;
Minimum Diameter /Space of BGA: 0.2mm/0.35mm;
Maximum Part's High: 18mm;
Maximum Part Weight: 30g;
PCB Size: 50mmx 50mm~450mmx 406mm;
PCB Thickness: 0.5mm~4. 5mm;
Placer Speed: 8,0000 Chips/Hour;
Feeders Number: 140 Piece of 8 mm Reel Feeders,28 of IC Tray Feede;
PCB Material: Fr4, High Tg Fr4,Halogen Free Material,Cem-3,etc;
Solder Mask Color: Green, Red, Black, Blue, White, Yellow, Matt, etc.;
Service: One-Stop Service;
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Tin;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Operating System: OEM;
PCB Testing: Flying Probe PCB Testing;
Applications: Industrial Equipment Board;
Design Philosophy: Customize;
Stocking Time: 3-5 Days;
Functional Application: Global Electronic Industry Application Fields;
Copper Thickness: 0.5oz~12oz(14.17g~340.19g);
Supplier Type: Original Manufacturer/OEM/EMS;
PCBA Service: SMT, DIP, One-Stop Turnkey PCBA Service;
Surface Finish: HASL, Enig, Immersion Ti, Immersion Silver, etc.;
Material: Fr-4/Fr1/Cem-1/Cem-3/Polyimild/PTFE/Rogersaluminum;
Color: Blue. Green. Red. Black;
Testing: 100% Aoi / X-ray / Ict/Aging Test/Functional Test;
Solder Type: Lead-Free - RoHS Compliant;
Stencils: Laser-Cut Stainless Steel Stencil;
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