| Specification |
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: The Paper Ring Gas Resin;
Brand: OEM ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;
Layer: 1-60 Layers;
Service: Turnkey Assembly PCB Service;
Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui;
Copper Thickness: 1-10oz;
Min. SMD Size: 01005;
QA Inspection: Aoi, X-ray, Ict;
Order Qty: No Limited;
Condition: New;
Controlling Range: -40c~125c;
Solder Resist Color: Green;Red;Yellow;Black;White;
Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask;
Trade Mark: OEM, ODM;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Fastline;
Board Material: Aluminum;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Min. Hole Size: 0.25mm;
Min. Line Width: 0.15mm;
Min. Line Spacing: 0.15mm;
Surface Treatment: HASL Lead Free;
Lead Time: 5-7 Working Days;
Small Order: Accepted;
PCB Type: Aluminum LED PCB Board;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Aluminum;
Board Material: Aluminum Base PCB;
Board Thickness: 1.0 mm;
Copper Thickness: 1 Oz (35um);
Surface Treatment: HASL Lead Free;
Solder Mask: Black/White;
Silkscreen: White/Silkscreen;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Rogers;
Base Material: Rogers;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Rogers;
Board Thickness: 0.8 mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Rogers;
Base Material: Rogers;
Insulation Materials: Organic Resin;
Processing Technology: Delay Pressure Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Rogers;
Board Thickness: 0.8 mm;
Board Layer: 1 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 5-8 Working Days;
PCB Board Type: RO4003 PCB Board;
Payment Type: Paypal, Tt, Western Union, Net 30days;
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