| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey;
Application: Electronic Products;
Customized: Customizable;
Quality Standard: Ipc 610 Class II;
Board Thickness: 0.4-2.0mm;
Surface Finihsing: OSP, HASL, Lf HASL, Enig, Carbon Oil, Enepig;
Lead Time: 6-8 Workdays;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Copper Thickness: 0.5-4 Oz;
Layer: 1-20 Layers;
Board Material: Fr4, H-Tg, Cem, Aluminum, Copper Base;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
Transportation: DHL, TNT, UPS, FedEx IP/Ie, EMS, Air/Sea Shipment;
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 Mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 Mm;
Min Line Width&Space: 0.15 Mm;
Solder Mask: White/Black;
Silksreen: Black/ White;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Brand: Fastline Rigid PCB Circuits Board;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf/Immersion Gold/Immersion Tin/;
Lead Time: 6-8 Working Days;
Test: Fly Probe Testing;
Max PCB Size: 1200*500mm;
Minimum Order: 1 PCS;
Min Board Thickness: Single and Double Sided Is 0.1mm;
Min Pad: +/-0.1mm(4mil);
Min Conductor Width: 0.05mm (2mil);
Min Conductor Spacing: 0.05mm (2mil);
Thickness of Copper Foil Wire: 8-240um (4oz);
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Type: Rigid Circuit Board;
Dielectric: Aluminium;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: Aluminium;
Brand: Ca;
Board Material: Aluminum;
Board Layer: 2;
Board Thickness: 1.6 mm;
Copper Thickness: 1 Oz;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Solder Mask: White;
Silksreen: Black;
Surface Fnishing: HASL-Lf;
Lead Time: 5-6 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4 and Polyimide;
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