| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: No Brand;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Test: Fly Probe Tseting;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Min. Hole Size: 0.20 mm;
Min Line Width&Space: 0.15 mm;
Test: Fly Probe Tseting;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 2 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
Board Material: Fr4 and Polyimide;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Polyimide, Fiberglass Epoxy;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Consumer Electronics;
Flame Retardant Properties: V0, V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Polyimide, Copper;
Insulation Materials: Epoxy Resin, Organic Resin;
Brand: Customized Brand;
Structure: Double-Sided FPC;
Combination Mode: Adhesive Flexible Plate;
Conductive Adhesive: Conductive Silver Paste;
Board Material: Polyimide;
Board Layer: 2;
Board Thickness: 0.1 mm;
Copper Thickness: 1 Oz;
Solser Mask: Yellow;
Silkscreen: White;
Surface Finishing: Enig;
Lead Time: 4-5 Working Days;
Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
PCB Inspection: Aoi Inspection;
Min Line Width / Spacing: 0.1/0.1mm;
Pattern Registration Tolerance: ±0.1mm (Working Panel Size: 250*300mm);
Min Pad Size: 0.2mm;
Coverlay Registration Tolerance: +/-0.15mm;
Solder Mask Registration Tolerance: +/-0.2mm;
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