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Board Assemblly
US$2.50-15.50 / Piece
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What is PCB Circuit Board Fabrication PCBA Assembly Factory Board Assembly

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$15.50

500+ Pieces US$2.50

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fr4
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Grandtop
  • Transport Package High Quality Carton Box Outside with Bubble Bag in
  • Specification Customized
  • Trademark OEM
  • Origin China
  • Board Service Board Assembly

Product Description

PCB Circuit Board PCBA Assembly PCB Assembly Fabrication Factory ISO9001 ISO13485 IATF16949 OEM PCBA Manufacturer | Turnkey pcb assembly Our service Turnkey EMS contract manufacturing: 1. pcb layout, pcb manufacturing for pcb prototype and batch pcbs, layers 1- 40 2. Components sourcing ...

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Board Assemblly Comparison
Transaction Info
Price US$2.50-15.50 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Board Service: Board Assembly;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

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