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ODM PCBA
US$1.00-25.00 / Piece
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What is Printed Circuit Board Assembly OEM ODM PCBA Mannufacturer for Medical Device

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-25.00 / Piece

Sepcifications

  • Metal Coating Tin
  • Mode of Production SMT+DIP
  • Layers Double-Layer
  • Base Material FR-4
  • Certification RoHS, ISO, ISO13485/ IATF16949
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bag
  • Specification PCBA
  • Trademark Grandtop
  • Origin China
  • Item ODM PCBA
  • PCB Layer 1-28 Layers
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • PCBA Min. Chip Placement 0201
  • Turnkey Service PCB, PCB Assembly, Box Build
  • Other PCBA Service Conformal Coating
  • Applicaton Medical PCB PCBA

Product Description

printed circuit board assembly OEM ODM PCBA Mannufacturer for Medical Device Grandtop is pcb PCBA manufacturer specialized in PCB and assembling, pcba contract manufacturing and final products assembly service . We have professional team and quality control system. Our long-cooperation with global ...

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ODM PCBA Comparison
Transaction Info
Price US$1.00-25.00 / Piece US$0.50-0.80 / Piece US$0.01 / Piece US$0.01 / Piece US$0.01-10.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union
Quality Control
Product Certification RoHS, ISO, ISO13485/ IATF16949 RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO, UL
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Western Europe, Eastern Asia, Southeast Asia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Tin;
Mode of Production: SMT+DIP;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: ODM PCBA;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Medical PCB PCBA;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr4;
Surface Finish: HASL;
Printing Ink: Green;
Silk-Screen: White;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
Metal Coating: Enig / HASL / OSP / Silver etc.;
Mode of Production: SMT / DIP / Customized;
Layers: From 2 Layers to 50 Layers;
Base Material: Fr4/ High Tg Fr4/ Metal Core / Cem;
Customized: Customized;
Condition: New;
Solder Mask Color: Green,Blue,Yellow,White,Black,Red;
Special Process: Buried Hole, Blind Hole, Partial High Density, Bac;
Copper Thickness: 1/2oz,1oz,2oz,3oz,4oz,5oz-10 Oz;
Layer Count: 1-50 Layers;
Quality Standard: Ipc Class 2 and Ipc Class 3;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: 1-20 Layers;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
Layer: 1-20 Layers;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Insulation Layer Thickness: 0.075mm--5.00mm;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Core Hecheng Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

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