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PCBA Assembly
US$2.50-15.50 / Piece
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What is Printed Circuit Board SMT PCBA Assembly and PCB Clone for BGA Control Board

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$15.50

500+ Pieces US$2.50

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fr4
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Grandtop
  • Transport Package High Quality Carton Box Outside with Bubble Bag in
  • Specification Customized
  • Trademark OEM
  • Origin China

Product Description

Printed Circuit Board PCB/PCBA SMT/BGA Control Board /PCBA Assembly 1. PCB, FPC, LED PCB, Membrane Switch : Gerber file and other PCB files. We would appreciate if you can confirm listed PCB specification also. 1).Material 2). Board thickness 3). Copper thickness 4). Surface finishing 5). ...

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PCBA Assembly Comparison
Transaction Info
Price US$2.50-15.50 / Piece US$0.04-0.10 / PCS US$0.01-0.30 / Piece US$0.01-0.30 / Piece US$0.99-20.00 / Piece
Min Order 1 Piece 1 PCS 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue - - - - -
Business Model - - - - ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Type: Flex-Rigid PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: UC;
Surface Finihsing: Immersion Gold;
Board Thickness: 1.6mm;
Lead Time: 6-8 Working Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Flex-Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.1mm;
Copper Thickness: 35um;
Surface Finish: Enig;
Solder Mask: Coverlay;
Legend: Without;
Type: PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Unice;
Layer: 1-20;
Finished Outer Copper Thickness: H/H0z-5/50z;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Abis Circuits Co., Ltd.

Diamond Member Audited Supplier

Jian Unice Pcb Technique Co., Ltd

Gold Member Audited Supplier

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