| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
Applications: Production;
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 14;
Base Material: Fr-4 Tg170;
Customized: Customized;
Condition: New;
Board Thickness: 0.2-6.0 mm;
Copper: 0.5-12 Oz;
Min Hole Size: 0.15 mm;
DIP Capacity: 100 Thousand Pins/Day;
Application: Communications, Industrial Control, Semiconductors;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min BGA Ball Pitch: 0.4mm;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: 14;
Base Material: Fr-4 Tg170;
Customized: Customized;
Condition: New;
Board Thickness: 0.2-6.0 mm;
Copper: 0.5-12 Oz;
Min Hole Size: 0.15 mm;
DIP Capacity: 100 Thousand Pins/Day;
Application: Communications, Industrial Control, Semiconductors;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min BGA Ball Pitch: 0.4mm;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
|
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min Trace/Space: 3/3 Mil;
Copper Thickness: 1-12 Oz;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Application: Power and Energy, Medical Equipment, Automotive EL;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
|
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver,Immersio;
Min Trace/Space: 3/3 Mil;
Copper Thickness: 1-12 Oz;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange, Pink,PU;
Application: Power and Energy, Medical Equipment, Automotive EL;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
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