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PCB Bare Board Assembly
US$1.00-25.00 / Piece
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What is China Smart Meter OEM Multilayer PCB Bare Board Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$1.00-25.00 / Piece

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT+DIP
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, ISO, ISO13485/ IATF16949
  • Customized Customized
  • Condition New
  • Transport Package Anti-Static Bag
  • Specification PCBA BORAD
  • Trademark Grandtop
  • Origin China
  • Item Circuit PCBA Board
  • PCB Layer 1-28 Layers
  • PCBA Min. IC Pitch 0.30mm(12mil)
  • PCBA Foot Pin So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA
  • PCBA Min. Chip Placement 0201
  • Turnkey Service PCB, PCB Assembly, Box Build
  • Other PCBA Service Conformal Coating
  • Applicaton Automobile Flexible PCBA Board
  • Souring 1 PCB Bare Board Assembly 20210130

Product Description

China Smart Meter OEM Multilayer pcb bare board assembly Grandtop is smt PCBA manufacturer specialized in PCB and assembly, pcba contract manufacturing and final products assembly service . We have professional team and quality control system. Our long-cooperation with global electric components ...

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PCB Bare Board Assembly Comparison
Transaction Info
Price US$1.00-25.00 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification RoHS, ISO, ISO13485/ IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT+DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Item: Circuit PCBA Board;
PCB Layer: 1-28 Layers;
PCBA Min. IC Pitch: 0.30mm(12mil);
PCBA Foot Pin: So, Sop, Soj, Tsop, Tssop, Qfp, BGA and U-BGA;
PCBA Min. Chip Placement: 0201;
Turnkey Service: PCB, PCB Assembly, Box Build;
Other PCBA Service: Conformal Coating;
Applicaton: Automobile Flexible PCBA Board;
Souring 1: PCB Bare Board Assembly 20210130;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

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