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Professional OEM PCB Board PCBA Assembly PCBA Manufacturer

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-499 Pieces US$15.50

500+ Pieces US$2.50

Sepcifications

  • Type Combining Rigid Circuit Board
  • Dielectric FR-4
  • Material Fr4
  • Application Consumer Electronics
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Aluminum
  • Insulation Materials Epoxy Resin
  • Brand Grandtop
  • Transport Package High Quality Carton Box Outside with Bubble Bag in
  • Origin China

Product Description

Company Information : Shenzhen Grandtop Automation Co., Ltd was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for global customers. We have more than 10 years of SMT manufacturing experience, ...

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PCBA Manufacturer Comparison
Transaction Info
Price US$2.50-15.50 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.10-1.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T T/T, Western Union T/T, Western Union T/T, Western Union LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Grandtop;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Combining Rigid Circuit Board;
Dielectric: MCPCB\Fr4\Bt;
Application: New Energy Vehicle Electronic Control Board;
Flame Retardant Properties: Customized;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Double-Sided/Multilayer Aluminum/Copper;
Insulation Materials: Customized;
Brand: Hongyu;
Board Thickness: 1.6mm;
Metal Core PCB: T2 High Conductivity Copper(1.6mm);
Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
Copper Foil: 70μm;
Tg: 150°C;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Brand: Cry;
Base Material 1: MCPCB;
Base Material Thickness: 0.8mm-4.0mm;
Min. Hole Diameter: 0.25mm;
Min. Line Spacing: 0.2mm;
Testing Service: 100% Aoi Testing;
Color: Red Blue Green Black White;
Surface Finishing: Enig, HASL, OSP;
MOQ: 1PCS;
Product Type: Metal Core PCB;
Supplier Name

Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Jiangxi Hongyu Circuit Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Chengruyuan Technology Co., Ltd.

Diamond Member Audited Supplier

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