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Adum2250arwz-Rl Components New Original Tested Integrated Circuit Chip

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.20-0.45 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China
  • Capacity 1000000
  • OEM/ODM Available
  • Sample Available
  • Surface Treatment OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes
  • Test 100%E-Testing
  • Min Bonding Pad Diameter 10mil
  • Min Thickness of Soldermask 10um
  • Color of Silk-Screen White, Yellow, Black
  • Data File Format Gerber File and Drilling File, Protel Series, ...
  • Material for PCB Fr-4, High Tg Fr$, Halogen Free,
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. Board Size 23.00" x ...

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PCBA Manufacturing Comparison
Transaction Info
Price US$0.20-0.45 / Piece US$0.30-5.00 / pieces US$0.30-5.00 / pieces US$0.50-1.00 / Piece US$0.50-1.00 / Piece
Min Order 1 Piece 5 pieces 5 pieces 10 Pieces 10 Pieces
Payment Terms T/T, PayPal, Western Union T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - RoHS, ISO9001:2015, CE RoHS, ISO9001:2015, CE - -
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America North America
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Mustar;
D/C: Standard;
Condition: New Original;
Warranty: 2 Years;
Mountng Type: SMT ,DIP;
Memory Type: Standard;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

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