| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
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Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Spacing: 0.075mm;
Min. Line Width: 0.15mm;
Board Size: Custom;
Board Thickness: 0.2-4.0mm;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Gold Plating Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
Board Thickness: 1.6mm;
Model Number: PCB;
Place of Origin: Guangdong, China;
Copper Thickness: 0.5oz-5oz;
Min. Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Service: One-Stop OEM Service;
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