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PCBA Manufacturing
US$0.03-10.00 / Piece
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What is PCB Circuit Boards Custom OEM ODM PCBA

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China
  • Capacity 1000000
  • OEM/ODM Available
  • Sample Available
  • Surface Treatment OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes
  • Test 100%E-Testing
  • Min Bonding Pad Diameter 10mil
  • Min Thickness of Soldermask 10um
  • Color of Silk-Screen White, Yellow, Black
  • Data File Format Gerber File and Drilling File, Protel Series, ...
  • Material for PCB High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

Learn More

PCBA Manufacturing Comparison
Transaction Info
Price US$0.03-10.00 / Piece US$670.00 / pcs US$0.10-0.99 / Piece US$0.10-0.99 / Piece US$0.10-0.99 / Piece
Min Order 1 Piece 1 pcs 10 Pieces 10 Pieces 10 Pieces
Payment Terms T/T, PayPal, Western Union T/T, PayPal, Money Gram, Small-amount payment, Western Union LC, T/T, D/P LC, T/T, D/P LC, T/T, D/P
Quality Control
Management System Certification - - ISO9001:2015 ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Southeast Asia, Mid East, North America, South America, Eastern Asia, Western Europe, Eastern Europe, Oceania Domestic Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM - ODM ODM ODM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Industrial Automation, VFD Inverter;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Vacon;
Vacon: Inverter Drive Board;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Foshan Weiken Electrical Equipment Co., Ltd.

Gold Member

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

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