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OEM Customized Electronic Circuit Board PCBA PCB Manufacturing and Assembly Design Service

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Pieces US$0.20-8.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric CEM-3
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Metal Composite Materials
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Soldermask Color Green, Yellow, Blue, Black, White...
  • Sample Available
  • OEM/ODM Available
  • Certificate Gurantee Yes
  • Test 100%E-Testing
  • Color of Silk Screen Green, Purple, Black
  • Service OEM / Dfm

Product Description

I.Who we are? NEW CHIP INTERNATIONAL LIMITED(Hereafter called NEW CHIP) is a professional agent and distributor of electronic components, wholly owned by H. C. C. International limited(found in 2004), whose business scope covers PCBA, ODM and electronic components. NEW CHIP has a ...

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PCB Comparison
Transaction Info
Price US$0.20-8.00 / Piece US$0.16-0.26 / Piece US$0.86-2.48 / Piece US$0.86-4.69 / Piece US$0.16-0.26 / Piece
Min Order 2 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue - - - - -
Business Model ODM, OEM - - - -
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: New Chip;
Soldermask Color: Green, Yellow, Blue, Black, White...;
Sample: Available;
OEM/ODM: Available;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Color of Silk Screen: Green, Purple, Black;
Service: OEM / Dfm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Test: Flying Probe Text;
Max PCB Size: 650*650mm;
Board Material: Fr4;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: OSP;
Lead Time: 6-8 Working Days;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

Fastline Circuits Co., Limited

Diamond Member Audited Supplier

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