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Trusted Valued PCBA Factory ISO9001 and ISO13485 Certificate PCB Design & Layout Services AMP PCB

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Pieces US$2.00-4.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Layer 1-32 Layers
  • Service OEM/ODM
  • OEM/ODM Available
  • Test 100%E-Testing
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea
  • Surface Treatmen OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes

Product Description

Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

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PCB Comparison
Transaction Info
Price US$2.00-4.50 / Piece US$2.68-5.60 / Piece US$12.00-20.00 / Piece US$2.68-5.60 / Piece US$2.68-5.60 / Piece
Min Order 2 Pieces 1 Piece 100 Pieces 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - RoHS/ISO9001/Ts16949/ISO14001/ISO13485 - RoHS/ISO9001/Ts16949/ISO14001/ISO13485 RoHS/ISO9001/Ts16949/ISO14001/ISO13485
Management System Certification - - ISO9001:2015 - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America Domestic North America North America
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: one month
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Hongzhou;
PCBA-Testing: X-ray, Aoi;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Mu Star (shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

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