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PCB PCBA, Electronic Components PCB Board Assembly

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

2 Pieces US$2.00-4.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Communication
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand New Chip
  • Transport Package Vacuum Packaging, Carton Box
  • Specification FR-4 SILICON COMPONENTS
  • Trademark New Chip
  • Origin China
  • Layer 1-32 Layers
  • Service OEM/ODM
  • OEM/ODM Available
  • Test 100%E-Testing
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea
  • Surface Treatmen OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes

Product Description

Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

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PCB Comparison
Transaction Info
Price US$2.00-4.50 / Piece US$0.10-0.99 / Piece US$0.10-0.99 / Piece US$0.50-4.90 / pieces US$0.50-3.00 / pieces
Min Order 2 Pieces 10 Pieces 10 Pieces 5 pieces 5 pieces
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P LC, T/T, D/P T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification - - - RoHS, Is09001:2000, CE RoHS, Is09001:2000
Management System Certification - ISO9001:2015 ISO9001:2015 - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Domestic Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM ODM Own Brand, ODM, OEM Own Brand, ODM, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: New Chip;
Layer: 1-32 Layers;
Service: OEM/ODM;
OEM/ODM: Available;
Test: 100%E-Testing;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Surface Treatmen: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customized;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Brand: Customized;
Type: Smart Electronics PCBA;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4/Tg/Cem-1/Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Shape: Rectangular, Round, Slots, Cutouts, Complex Irramu;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Type: Multilayer PCB;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4,Tg,Cem-1,Aluminium;
Insulation Materials: Organic Resin;
Brand: Smart;
Number of Layers: 2/4/6/8/12/14or Custom;
Copper Thickness: 0.5-6.0oz;
Min.Hole Size: 0.1mm;
Board Size: Custom;
Min.Line Width: 0.15mm;
Board Thickness: 0.2-4.0mm;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Huzhou Ganchuang Electronic Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

Shenzhen Smart Electronics Co., Ltd

Diamond Member Audited Supplier

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