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Electronic Product Provide Geber & Bom PCBA OEM

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Consumer Electronics
  • Flame Retardant Properties V2
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Transport Package Foam Packing
  • Specification FR4 1-4 Layers
  • Trademark New Chip
  • Origin China
  • Capacity 1000000
  • OEM/ODM Available
  • Sample Available
  • Surface Treatment OSP, Enig, HASL, AG Immersion
  • Certificate Gurantee Yes
  • Test 100%E-Testing
  • Min Bonding Pad Diameter 10mil
  • Min Thickness of Soldermask 10um
  • Color of Silk-Screen White, Yellow, Black
  • Data File Format Gerber File and Drilling File, Protel Series, ...
  • Material for PCB Fr-4, High Tg Fr$, Halogen Free
  • Layer Count 1-20 Layers
  • Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

Learn More

PCBA Manufacturing Comparison
Transaction Info
Price US$0.03-10.00 / Piece US$5.00-25.00 / Piece US$5.00-25.00 / Piece US$5.00-25.00 / Piece US$5.00-25.00 / Piece
Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Europe, Australia, Domestic North America, Europe, Australia, Domestic North America, Europe, Australia, Domestic North America, Europe, Australia, Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM Own Brand, OEM Own Brand, OEM Own Brand, OEM Own Brand, OEM
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Consumer Electronics;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Capacity: 1000000;
OEM/ODM: Available;
Sample: Available;
Surface Treatment: OSP, Enig, HASL, AG Immersion;
Certificate Gurantee: Yes;
Test: 100%E-Testing;
Min Bonding Pad Diameter: 10mil;
Min Thickness of Soldermask: 10um;
Color of Silk-Screen: White, Yellow, Black;
Data File Format: Gerber File and Drilling File, Protel Series, ...;
Material for PCB: Fr-4, High Tg Fr$, Halogen Free;
Layer Count: 1-20 Layers;
Shipping: DHL/UPS/FedEx/Air/Sea;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Aerospace;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Jc;
Supplier Name

Shenzhen New Chip international Ltd

Gold Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Jia Cheng Electric Co., Ltd.

Diamond Member Audited Supplier

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