| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Mzh;
Board Thickness: 1.0mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm;
Max Copper: 12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min Trace/Space: 3/3 Mil;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Fastest Delivery Time: 24 Hours (Sample);
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: PP;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Kb, Shenyi, Rogers, Iteq;
Shenzhen: China;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
PCB Board Thickness: 2.5mm;
PCB Cooper: 35um;
PCB Mask: Green Mask;
PCB Silk: White;
|
Type: Rigid Circuit Board;
Dielectric: Aluminum Base Board;
Material: Aluminum;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Abis;
Enig Thickness: 1-3u'';
Thermal Conductivity: 0.8-3W/M.K;
Copper Thickness: 1-6oz;
Board Thickness: 0.3-5mm;
Color Temparature: 2600-9000K;
CRI: >=80;
Brightness Grade: >60 Lm;
LED Type: 3528/2835/5050/3014/5730/3030;
Hard Gold Thickness: 5-50u'';
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Abis;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thick: 0.2-8mm;
Copper Thick: 2oz;
Quick Turn for 2layer: 24hours;
Minimum Space/Line: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
|