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High-Precision Assembly
US$0.55-5.50 / Piece
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What is High-Precision Circuit Board Assembly for Multi-Panel Production Needs

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

1 Piece US$0.55-5.50 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Mzh
  • Transport Package Vacuum Packing, Blister, Plastic, Cartoon
  • Specification 5 x 5 MM-900 x 600 MM
  • Trademark MZH
  • Origin Guangdong, China
  • Board Thickness 0.2-6.0 mm
  • Certification UL, ISO 9001, ISO 14001, Reach, IATF16949, CQC
  • Inspection Standard Ipc-II, Ipc-III, Ppap
  • Copper 0.5-12 Oz
  • Min Laser Holes 0.1 mm
  • Service PCB+PCBA+Components+Reverse Engineer
  • Surface Finishing Lf Hal, OSP, Enig, Enepig, Immersion Silver
  • Solder Resist Color Green, Blue, Red, Yellow, Black, White, Orange
  • Aspect Ratio 20:1
  • Min Trace/Space 3/3 Mil
  • Application Industries Communications, Industrial Control, Semiconductors
  • Delivery Time Within 3 Days(Sample)

Product Description

Multi-Panel Our Multi-Panel service supports multiple panelization methods to accommodate diverse board types and process requirements, ensuring structural stability and precise alignment. By integrating intelligent layout planning with DFM optimization, it effectively shortens production cycles and ...

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High-Precision Assembly Comparison
Transaction Info
Price US$0.55-5.50 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 1 Piece 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
Quality Control
Product Certification UL, ISO 9001, ISO 14001, Reach, IATF16949, CQC RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model ODM, OEM OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mzh;
Board Thickness: 0.2-6.0 mm;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Copper: 0.5-12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Aspect Ratio: 20:1;
Min Trace/Space: 3/3 Mil;
Application Industries: Communications, Industrial Control, Semiconductors;
Delivery Time: Within 3 Days(Sample);
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Supplier Name

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

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