| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Hw-Ms03 PCB Microwave Sensor Module;
Brand: Pyroelectric Infrared Sensor;
Theory: Thermal Infrared Sensing;
Voltage - Supply: 2~15V;
Current - Supply: Vd=5V,RS=47K;
Mounting Type: Wall or Ceiling;
Size: 40*20*3mm;
Features: Human Detect;
Angle: 180*360;
Voltage - Rated: Na;
Voltage - Input: 3.3V;
Output: >3000MVP-P;
Amplifier Type: Operational Amplifier;
Output Type: Balanced Differential Output;
Voltage Rating: 2.2V;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Model Number: Hw-Ms07 PCB Microwave Sensor Module;
Brand: Pyroelectric Infrared Sensor;
Theory: Optical Sensor;
Current: <3mA;
Distance: 2m+-20cm;
Frequency: 3.2GHz;
Size: 30*18*4mm;
Features: Human Detect;
Voltage - Rated: Na;
Voltage - Input: 3.3V;
Output: >3000MVP-P;
Amplifier Type: Operational Amplifier;
Output Type: Balanced Differential Output;
Supply Voltage: DC 3.7V-24V;
Samples: Offered;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Insulation Materials: Organic Resin;
Material: Complex;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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