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Medical PCBA Manufacturer
US$5.00-30.00 / Piece
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What is Professional One-Stop Multilayer PCB Circuit Board Assembly Custom Medical PCBA Manufacturer

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$30.00

1,000-2,999 Pieces US$10.00

3,000-4,999 Pieces US$7.00

5,000+ Pieces US$5.00

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy Resin + Polyimide Resin
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Organic Resin
  • Brand Mu Star
  • Transport Package DHL, FedEx, UPS, EMS
  • Specification Customized
  • Trademark Customized
  • Origin China
  • Product Name PCB Circuit Board PCBA
  • MOQ 1PCS
  • Layers 1-64 Layers
  • Board Thickness 0.4mm-10.0mm
  • Copper Thickness 1-10oz
  • Solder Mask Color White.Black.Yellow.Green.Red.Blue
  • Surface Finishing HASL(Lead-Free), Enig, Immersion Gold, Immersion T
  • Service PCB, Components, PCBA, SMT, DIP, Testing Service
  • Certificate ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD Professional One-Stop Multilayer PCB Circuit Board Assembly Custom Medical PCBA Manufacturer Our Advantage: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% functional test. 3. ...

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Medical PCBA Manufacturer Comparison
Transaction Info
Price US$5.00-30.00 / Piece US$0.98-5.00 / Piece US$1.10-1.30 / Piece US$0.80-13.00 / Piece US$2.01-5.00 / Piece
Min Order 1 Piece 10 Pieces 1 Piece 10 Pieces 10 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, PayPal, Western Union T/T T/T
Quality Control
Product Certification ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS RoHS, CCC, ISO - RoHS, CCC, ISO RoHS, CCC, ISO
Management System Certification - ISO9001:2015 - ISO9001:2015 ISO9001:2015
Trade Capacity
Export Markets Europe Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe Domestic Domestic
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM - ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mu Star;
Product Name: PCB Circuit Board PCBA;
MOQ: 1PCS;
Layers: 1-64 Layers;
Board Thickness: 0.4mm-10.0mm;
Copper Thickness: 1-10oz;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Layer Count: 4layer;
Board Thickness: 1.6mm;
Board Material: Fr4;
Surface Finish: Enig/1u'';
Soldermask Color: Black;
Cooper Thickness: 1oz;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Type: Customized;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Customized;
Processing Technology: Customized;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: OEM/ODM;
PCBA-Testing: X-ray, Aoi;
Processing: Electrolytic Foil;
SMT Capacity: >2 Million Points/Day;
DIP Capacity: >100K Parts/Day;
Min. Space of BGA: +/- 0.3mm;
Min.Pin Space of IC: 0.3mm;
Max.Precision of IC Assembly: 0.03mm;
Surface Finishing: Lead-Free HASL;
Number of Layers: 4-10 Layer;
Board Thickness: 1.6mm;
Supplier Name

Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Ucreate PCB Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Audited Supplier

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