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Mustar End-to-End PCBA Manufacturing - Customized Solutions for Medical Devices & Industrial Automation Video

About this Item
Details
Company Profile

Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$5.00

50-99 Pieces US$4.50

100-499 Pieces US$4.00

500-999 Pieces US$3.50

1,000+ Pieces US$3.00

Sepcifications

  • Metal Coating Gold
  • Mode of Production SMT
  • Layers Multilayer
  • Base Material FR-4
  • Certification RoHS, CCC, ISO, CE
  • Customized Customized
  • Condition New
  • Transport Package Unlimited
  • Specification unlimited
  • Trademark MUstar
  • Origin Shenzhen

Product Description

Welcome to Mu Star (Shenzhen) Industry Co., LTD Mustar Electronics Component Shenzhen New Original In Stock Microcontroller Integrated Circuit Microchip IC Parts BOM Service Our Advantages 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI ...

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PCBA Aseembly Comparison
Transaction Info
Price US$3.00-5.00 / Piece US$0.68-10.80 / Piece US$0.68-10.80 / Piece US$6.20 / Piece US$6.20 / Piece
Min Order 10 Pieces 1 Piece 1 Piece 1 Piece 1 Piece
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment PayPal, T/T PayPal, T/T LC, T/T, PayPal, Western Union, Small-amount payment, D/P LC, T/T, PayPal, Western Union, Small-amount payment, D/P
Quality Control
Product Certification RoHS, CCC, ISO, CE RoHS, ISO RoHS, ISO RoHS, CCC, ISO, UL,IATF16949 RoHS, CCC, ISO, UL,IATF16949
Management System Certification - - - - -
Trade Capacity
Export Markets Europe North America, Europe North America, Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Western Europe
Annual Export Revenue - - - - -
Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: one month
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays
Product Attributes
Specification
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;;
Soldermask Color: White, Black, Green, Blue etc.;;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;;
Conditions: New;
Finished Thickness: 0.8~1.6mm;
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: Used;
OEM/Odml: OEM/ODM;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;;
Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG;;
Soldermask Color: White, Black, Green, Blue etc.;;
Surface Finishedc: HASL, Gold Finger, OSP, Enig, Peelable Mask;;
Conditions: New;
Finished Thickness: 0.8~1.6mm;
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Material: Fr-4(Tg135,Tg150,Tg170, Tg180,Tg250);
Number of Layers: 1-48 Layers;
Board Thickness: 0.2-6.0 mm;
Copper Thickness: 0.5-12 Oz;
Service: PCB+PCBA+Components+Reverse Engineer;
Application: Communications, Industrial Control, Semiconductors;
Min Board Size: 5 X 5 mm;
Max Board Size: 900 X 600 mm;
Min Hole Size: 0.15 mm;
Surface Finishing: Lf Hal, OSP,Enig, Enepig,Immersion Silver;
Min BGA Ball Pitch: 0.4mm;
DIP Capacity: 100 Thousand Pins/Day;
Solder Resist Color: Green,Blue, Red,Yellow,Black,White,Orange;
PCBA-Testing: Aoi,X-ray,Function Test;
Delivery Time: Within 3 Days(Sample);
Supplier Name

Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

China Dragon Electronic Industrial Co., Limited

Diamond Member Audited Supplier

China Dragon Electronic Industrial Co., Limited

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

Shenzhen Mzh Pcb., Co Ltd

Diamond Member Audited Supplier

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