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Full Automatic High-Density HDI PCBA Assembly Factory

About this Item
Details
Company Profile

Price

Min. Order Reference FOB Price

5 Pieces US$10.00 / Piece

Sepcifications

  • Type Rigid Circuit Board
  • Dielectric FR-4
  • Material Fiberglass Epoxy
  • Application Medical Instruments
  • Flame Retardant Properties V0
  • Mechanical Rigid Rigid
  • Processing Technology Electrolytic Foil
  • Base Material Copper
  • Insulation Materials Epoxy Resin
  • Brand Mu Star
  • Transport Package Vacuum, Anti-Static, ESD
  • Specification 1120*800mm
  • Trademark Mu Star
  • Origin China
  • Solder Mask Color Green, Red, Black (as Your Require)
  • Silkscreen Color White, Black
  • Testing Service Ict, Function Test, X-ray, Aoi
  • Layers 1-64
  • MOQ 5PCS
  • Warranty 2 Years

Product Description

Specification 1 Material CEM-1, CEM-3, FR-4, Aluminum, Rogers, high Tg etc. 2 Board thickness Mass production: 394mil(10mm) Samples: 17.5mm 3 Surface finish HASL, OSP, Immersion Gold/Silver/Tin, ENIG, Gold Finger 4 PCB Max panel size 1150mm × 560mm 5 Layer 1-64 L 6 Min hole size Mechanical drill: ...

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PCB Circuit Board Assembly Comparison
Transaction Info
Price US$10.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
Min Order 5 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
Quality Control
Product Certification - RoHS RoHS RoHS RoHS
Management System Certification - - - - -
Trade Capacity
Export Markets Europe South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
Annual Export Revenue - - - - -
Business Model ODM, OEM OEM OEM OEM OEM
Average Lead Time Peak Season Lead Time: within 15 workdays, one month
Off Season Lead Time: within 15 workdays, one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month		 Peak Season Lead Time: one month
Off Season Lead Time: one month
Product Attributes
Specification
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Solder Mask Color: Green, Red, Black (as Your Require);
Silkscreen Color: White, Black;
Testing Service: Ict, Function Test, X-ray, Aoi;
Layers: 1-64;
MOQ: 5PCS;
Warranty: 2 Years;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thicknes: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Aluminum Covered Copper Foil Layer;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Sum;
PCB Layer: 2-4 Layers;
Baser Material: Fr4;
Board Thickness: 1mm;
Copper Thickness: 0.35mm;
Supplier Name

Mu Star (Shenzhen) Industry Co., Ltd.

Diamond Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

Yueqing Page Electrical Co., Ltd.

Gold Member Audited Supplier

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