| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy Resin + Polyimide Resin;
Application: New Energy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mu Star;
Product Name: PCB Circuit Board PCBA;
MOQ: 1PCS;
Layers: 1-64 Layers;
Board Thickness: 0.4mm-10.0mm;
Copper Thickness: 1-10oz;
Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Exceeding;
Min Hole Size: 0.1mm(4mil);
Min Line Spacing: 0.1mm(4mil);
Solder Mask: Green, White, Black, Blue, Red(Customized);
Board Thickness: 0.2mm-6mm;
Copper Thickness: 0.5oz-6oz(18um-210um);
Service: PCB/PCBA/Circuit Board/SMT/DIP;
PCBA QA: X-ray, Aoi Test, Function Test(100% Test);
Products Name: One-Stop PCB Assembly Professional Turnkey PCBA;
Origian: Shenzhen Guangdong;
MOQ: 1PCS;
Surface Finishing: HASL Lead Free, Immersion Gold/Silver.OSP.;
Industrial: LED, Medical, Industrial, Control Board;
Design: PCBA Layout and Engineering Support.;
Delivery Time: PCB 7-10dyas, PCBA 2-3weeks;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Computer;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Insulation Materials: Epoxy Resin;
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