| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Width Spacing: 0.015mm;
Minimum Line Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1 PCS;
Layers: 1-64;
Warranty: 2 Years;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Copper Thickness: 0.5oz-6oz;
Min. Hole Size: 0.1mm;
Min.Line Width: 0.075mm;
Min. Line Spacing: 0.075mm;
Functional Application: Industrial Control/Consumer Electronics/Other;
Board Thickness: 0.8mm~3.0mm;
Surface Finishing: HASL/HASL Lead Free/OSP/Enig/Silver Plating;
Testing Service: Fly-Probe/Aoi/X-ray/100%Function Testing;
Number of Layers: 1-6 Layers;
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Type: Rigid Circuit Board;
Dielectric: PTFE Ceramic;
Material: PTFE Ceramic;
Application: Power Backplanes;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Enig;
Base Material: PTFE Ceramic;
Insulation Materials: PTFE Ceramic;
Brand: Rogers;
Board Types: Rigid Laminate;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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