| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Medical Instruments;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Mu Star;
Color: Customized;
Testing Service: Aoi/ X-ray/ Fai;
Board Thickness: 1.6mm;
Number of Layers: 1-58 Layers;
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Type: Flexible Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Board Thickness: 0.20mm-8.00mm;
Maximum Size: 600mmx1200mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T≥0.8mm): +-8%;
Thickness Tolerance(T<0.8mm): +-8%;
Surface Finishing: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: Immersion Gold;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.2mm;
Min. Line Width: 0.1mm;
Min. Line Spacing: 0.1mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4, Al, Pi, Rogers;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Solder Mask: Green, White, Red, Blue, etc;
Used in: Robot, Uav, Computer, Medical Device;
Max Copper: 6 Oz;
Max Thickness: 6 mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fr4,Rogers,Alu,Cem1,Cem3;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Fexible;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Layer: 1-32;
Board Thickness: 0.15,0.8,1.0,1.6,2.0,2.4,2.8,3.0,3.2 mm;
Solder: Green/White/Black/Red/Blue/Purple/Orange/Yellow;
Silk: White/Black;
Surface Finish: Enig,HASL,HASL Lf, Immersion Tin,OSP;
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